Taiwanese chipset-making major MediaTek on Wednesday officially unveiled its new MediaTek Dimensity 9000+ chip which is the company’s top-of-the-line 5G chipset that claims to boost performance over the previous-gen Dimensity 9000 SoC and make the next generation of flagship smartphones more powerful and efficient. Unlike what its rival Qualcomm has done, MediaTek doesn’t bring a lot of improvements to Dimentisty 9000+ as compared to Dimensity 9000 SoC.
What’s different in Dimensity 9000+ from Dimensity 9000 is a higher-clocked prime core in the processor. The new Dimensity 9000+ SoC integrates Arm’s v9 CPU architecture with a 4nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.2GHz while Dimensity 9000 operated at 3.05GHz.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, said in a statement.
“With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
According to MediaTek, Dimensity 9000+ SoC is designed for the growing bandwidth demands of the mobile market. The integrated LPDDR5X supports 8MB L3 CPU cache and 6MB of system cache. The chipset also integrates MediaTek’s fifth-generation Application Processor Unit (APU 5.0) for powerful AI computing capabilities in a power-efficient design.